Herausgegeben von Maw-Ling Wang, Rong-Yeu Chang, Chia-Hsiang (David) Hsu,
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Maw-Ling Wang is a consultant for CoreTech System Co., Ltd. (Moldex 3D) and an Honorary Professor at National Chung Cheng University, Taiwan. From 2003 to 2014 he was Chair Professor, Dean, and Academic Vice President at Hungkuang University, Taiwan. He holds a PhD in Chemical Engineering from Clarkson University, Potsdam, U.S.A. and was previously a consultant at Sachem, Inc., TX.
Rong-Yeu Chang is CEO of CoreTech System Co., Ltd. (Moldex 3D), which he co-founded in 1995. From 1983 to 2015 he was Associate Professor/Professor, Department of Chemical Engineering, National Tsing-Hua University, Taiwan, where he had obtained his PhD. He is a Fellow of the Society of Plastics Engineers.
Chia-Hsiang (David) Hsu is President of Product and co-founder of CoreTech System Co., Ltd. (Moldex3D); previously (1999-2015) he was Director of Research and Development Division/Vice President. He holds a PhD from National Tsing-Hua University, Taiwan.
Maw-Ling Wang is a consultant for CoreTech System Co., Ltd. (Moldex 3D) and an Honorary Professor at National Chung Cheng University, Taiwan. From 2003 to 2014 he was Chair Professor, Dean, and Academic Vice President at Hungkuang University, Taiwan. He holds a PhD in Chemical Engineering from Clarkson University, Potsdam, U.S.A. and was previously a consultant at Sachem, Inc., TX.
Rong-Yeu Chang is CEO of CoreTech System Co., Ltd. (Moldex 3D), which he co-founded in 1995. From 1983 to 2015 he was Associate Professor/Professor, Department of Chemical Engineering, National Tsing-Hua University, Taiwan, where he had obtained his PhD. He is a Fellow of the Society of Plastics Engineers.
Chia-Hsiang (David) Hsu is President of Product and co-founder of CoreTech System Co., Ltd. (Moldex3D); previously (1999-2015) he was Director of Research and Development Division/Vice President. He holds a PhD from National Tsing-Hua University, Taiwan.
Die Coverdateien dürfen Sie zur Bewerbung des Buches honorarfrei verwenden.
Die Coverdateien dürfen Sie zur Bewerbung des Buches honorarfrei verwenden.